Principal Engineer, Packaging Development (Semiconductor)
SambaNova Systems
This job is no longer accepting applications
See open jobs at SambaNova Systems.See open jobs similar to "Principal Engineer, Packaging Development (Semiconductor)" Celesta.The third era of AI has arrived, powered by Generative AI. Generative AI is achieving step-function increases in scale, versatility, and accuracy compared to legacy AI technologies, presenting an opportunity for organizations to fundamentally transform their business and operations.
SambaNova Suite™ is enabling organizations and enterprises to achieve the transformative promise of these new AI technologies with a fully integrated hardware-software system that delivers innovation across the full AI stack, including the most accurate generative AI models, optimized for enterprise and government. This creates the AI backbone for the next 10 years and beyond.
Working at SambaNova
This role presents a unique opportunity to shape the future of AI and the value it can unlock across every aspect of an organization’s business and operations. SambaNova is hiring a senior-level Packaging Development Engineer to drive the most advanced packaging technology from conception to production.
Responsibilities
- Pathfinding - establish relationship with foundry, OSAT, material supplier to develop package development roadmap; plan test vehicle when necessary
- Product definition - drive physical architecture through collaboration with system architect for future product
- Product development - manage design process, review electrical, thermal, mechanical analysis result, final product sign-off
- New product introduction (NPI): manage DOEs for initial build and product qualification; drive triage effort with partners for any unexpected quality issue
Basic Qualifications
- MS degree in Mechanical Engineering, Materials Science or similar field
7+ years of experience in package design or related field
Additional Required Qualifications
- Experience in supply chain management (strategy, technical, and quality)
- Knowledge of advanced packaging manufacturing flows and processes
- Experience with successful package product qualification with large complex package design
- Understanding of device reliability and experience with physical failure analysis
Annual Salary Range and Level
The base salary for this position ranges from $165,000/year up to $210,000/year. This range is based on role, level, and location and reflects the salary target for new hires in the US. Individual pay within the range will depend on a number of factors, including a candidate’s job-related qualifications, skills, competencies and experience, and location.
Benefits Summary
SambaNova offers a competitive total rewards package, including the base salary, plus equity and benefits. We cover 95% premium coverage for employee medical insurance, and 80% premium coverage for dependents and offer a Health Savings Account(HSA) with employer contribution. We also offer Dental, Vision, Short/Long term Disability, Basic Life, Voluntary Life and AD&D insurance plans in addition to Flexible Spending Account(FSA) options like Health Care, Limited Purpose, and Dependent Care. Our library of well-being benefits includes a full subscription to Headspace, access to One Medical, counseling services with an Employee Assistance Program, and much more.
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Submission Guidelines
Please note that in order to be considered an applicant for any position at SambaNova Systems you must submit an application form for each position for which you believe you are qualified.
If you are a new, recent (within the last two years), or upcoming college graduate and are interested in opportunities with SambaNova Systems, please apply through our University job listings.
EEO Policy
SambaNova Systems is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard basis of age (40 and over), color, disability, gender identity, genetic information, marital status, military or veteran status, national origin/ancestry, race, religion, creed, sex (including pregnancy, childbirth, breastfeeding), sexual orientation, and any other applicable status protected by federal, state, or local laws.
Customers turn to SambaNova to quickly deploy state-of-the-art AI capabilities to meet the demands of the AI-enabled world. Our purpose-built enterprise-scale AI platform is the technology backbone for the next generation of AI computing. We enable customers to unlock the valuable business insights trapped in their data. Our flagship offering, SambaNova Suite™, provides the most accurate generative AI models, optimized for enterprise and government organizations, deployed on-premises or in the cloud, and adapted with an organization’s data for greater accuracy
This job is no longer accepting applications
See open jobs at SambaNova Systems.See open jobs similar to "Principal Engineer, Packaging Development (Semiconductor)" Celesta.