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Principal Engineer, Packaging Development (Semiconductor)

SambaNova Systems

SambaNova Systems

Palo Alto, CA, USA
Posted on Monday, December 11, 2023

The era of pervasive AI has arrived. In this era, organizations will use generative AI to unlock hidden value in their data, accelerate processes, reduce costs, drive efficiency and innovation to fundamentally transform their businesses and operations at scale.

SambaNova Suite™ is the first full-stack, generative AI platform, from chip to model, optimized for enterprise and government organizations. Powered by the intelligent SN40L chip, the SambaNova Suite is a fully integrated platform, delivered on-premises or in the cloud, combined with state-of-the-art open-source models that can be easily and securely fine-tuned using customer data for greater accuracy. Once adapted with customer data, customers retain model ownership in perpetuity, so they can turn generative AI into one of their most valuable assets.

Working at SambaNova

This role presents a unique opportunity to shape the future of AI and the value it can unlock across every aspect of an organization’s business and operations. SambaNova is hiring a senior-level Semiconductor Packaging Development Engineer to drive the most advanced packaging technology from conception to production for AI systems.

Responsibilities

  • Pathfinding - establish relationship with foundry, OSAT, material supplier to develop package development roadmap; plan mechanical and electrical test chip vehicle when necessary
  • Product definition - drive physical architecture through collaboration with system architect for future product
  • Product development - manage design process, review electrical, thermal, mechanical analysis result, final product sign-off
  • New product introduction (NPI): manage DOEs for initial build and product qualification; drive triage effort with partners for any unexpected quality issue

Basic Qualifications

  • MS degree in Mechanical Engineering, Materials Science or similar field
  • 7+ years of experience in package design or related field

Additional Required Qualifications

  • Experience in supply chain management (strategy, technical, and quality)
  • Knowledge of advanced packaging manufacturing flows and processes
  • Experience with successful package product qualification with large complex package design
  • Understanding of device reliability and experience with physical failure analysis

Annual Salary Range and Level

The base salary for this position ranges from $165,000/year up to $210,000/year. This range is based on role, level, and location and reflects the salary target for new hires in the US. Individual pay within the range will depend on a number of factors, including a candidate’s job-related qualifications, skills, competencies and experience, and location.

Benefits Summary

SambaNova offers a competitive total rewards package, including the base salary, plus equity and benefits. We cover 95% premium coverage for employee medical insurance, and 80% premium coverage for dependents and offer a Health Savings Account(HSA) with employer contribution. We also offer Dental, Vision, Short/Long term Disability, Basic Life, Voluntary Life and AD&D insurance plans in addition to Flexible Spending Account(FSA) options like Health Care, Limited Purpose, and Dependent Care. Our library of well-being benefits includes a full subscription to Headspace, access to One Medical, counseling services with an Employee Assistance Program, and much more.

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Submission Guidelines

Please note that in order to be considered an applicant for any position at SambaNova Systems, you must submit an application form for each position for which you believe you are qualified.

If you are a new, recent (within the last two years), or upcoming college graduate and are interested in opportunities with SambaNova Systems, please apply through our university job listings.

EEO Policy

SambaNova Systems is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard basis of age (40 and over), color, disability, gender identity, genetic information, marital status, military or veteran status, national origin/ancestry, race, religion, creed, sex (including pregnancy, childbirth, breastfeeding), sexual orientation, and any other applicable status protected by federal, state, or local laws.

Customers turn to SambaNova to quickly deploy state-of-the-art generative AI capabilities within the enterprise. Our purpose-built enterprise-scale AI platform is the technology backbone for the next generation of AI computing.

Headquartered in Palo Alto, California, SambaNova Systems was founded in 2017 by industry luminaries, and hardware and software design experts from Sun/Oracle and Stanford University. Investors include SoftBank Vision Fund 2, funds and accounts managed by BlackRock, Intel Capital, GV, Walden International, Temasek, GIC, Redline Capital, Atlantic Bridge Ventures, Celesta, and several others. Visit us at sambanova.ai. Follow SambaNova Systems on Linkedin.